86 mm OD x 0.1 mm Thickness Diamond Dicing Blades - EQ-EC422-Blade Wafer Holders

86 mm OD x 0.1 mm Thickness Diamond Dicing Blades - EQ-EC422-Blade Wafer HoldersSPECIFICATIONS: Part Number EQ EC 422 Blade Material Nickel bounded Stainless Steel Blade Diameter 86mm OD x 70 mm ID Blade Thickness 0. 1mm Center hole 0. 5" Grain Size 14 microns Features High precision cutting for hard and brittle nonmetal materials such as Si, Ge, Quartz, Ceramic, Ferrite and Glass, etc. Designed for SYJ 400 Dicing saw and Compatible with any dicing saw with 0. 5" diameter shaft. Replacement blade for aluminum alloy flange (not

53 liter 304 stainless steel chamber ( 16x13x14" )  provides a vacuum environment for degassing

7mm (ID) x 73

Ultrasonic Cleaner

Protection and Auto-recover

You may order an internal resistance tester to measure DC resistivity (click the second and third picture below for more information)

Pressure Calibration Kit: Load cell (Unit Kg) + Digital Meter

(80mm to 1'')

& Dimensions   Applications   Optional 4-pin electrical wires are available at the options bar (Pic

x 200 mm L

One order has 5 pieces of gasket

Film target thickness:       11 um  with  (thickness acceptation range) +/- 10%

Dopant concentration: ~5E18 /cc